2026-02-25

DAIC Spring 2026 hardware expansion round – call for research group participation.

DAIC is opening its Spring 2026 hardware expansion round.
Research groups interested in contributing compute resources are invited to participate.

Given current market signals indicating expected price increases (particularly for memory components) it is important to consolidate commitments early to secure favorable pricing.

Contributions will expand the shared GPU capacity available to participating groups.

Participation Window

Expressions of interest are requested by mid-March 2026.
Final commitments will be coordinated directly with participating groups.

Deadlines will be enforced to ensure timely procurement.

How to Participate

Groups interested in participating are encouraged to contact the REIT team to discuss:

  • Intended contribution amount
  • Funding source and project code
  • Hardware preferences